Ningbo ChipEx Semiconductor Co., Ltd was established in January 2013 with a total investment of 280 millions, and located in Hangzhou-Bay New Zoon, Ningbo (Exit of Hangzhou-Bay Bridge). ChipEx focused on Wafer Level CSP、FC-Bumping and other related business, also provide wafer testing, packaging design, packaging and testing for customers from local and overseas. Products are widely used in smart phones, tablet PCs, wearable electronic devices and other electronic products, expand to energy saving and environmental protection, intelligent home, bio-medical...