NINGBO CHIPEX SEMICONDUCTOR CO.,LTD
Add:No.18 Zhongheng Road,Huaxing District,Andong Industrial Park,Hang Zhou Bay New Zone,Ningbo
P.O:315327
Mail:sales@chipex.cn
Tel:(86)-574-63078606;
(86)-574-63078608-8858
ChipEx achieved high-density and small pitch product package by using wafer fabrication technology and packaging technology.
ChipEx offers a variety of wafer-level packaging process services, including repassivation layer, sputtering metal, plating, ball placement, wafer thinning, wafer sawing, grain picking and so on.