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Semiconductor packaging and testing process

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Semiconductor packaging and testing process

The package process is: cutting into small wafers by a dicing process after the front process, then glued on the corresponding substrate rack, making bond pads of the wafers connecting with the corresponding leads of the substrate by using ultra-fine metal wire or conductive resin and constitute the required circuit. And then separate the chip with a plastic shell to protect the package, after plastic, but also a series of operations, such as post-curing, cutting tendons and molding, plating and printing technology. After the completion of packaging products for inspection, testing and packaging processes and then finally inbound shipping. Typical packaging process including: dicing, loading, bond, plastic package, edge removing, plating, print, trim and form, visual inspection, product testing, packaging and shipment.