宁波芯健半导体有限公司
地址:宁波杭州湾新区庵东工业园区华兴地块中横路18号
邮编:315327
邮箱:sales@chipex.cn
电话:(86)-574-63078606;
(86)-574-63078608-8858
利用晶圆级封装技术(WLCSP)制作TVS器件,可使器件尺寸大大缩小,并且电性能和可靠性得到显著提高,封装周期短和成本低,已广泛应用与手机、MP3播放器、PDA和数码相机等便携式电子产品提供保护和提高其可靠性。
ltem | Standard | Other |
Die Size Without Dicing Street | 570x270um | NA |
Dicing Street | 60um | No metal allowed in the dicing street |
Bump pitch | 400um within | Follow customer requirement |
Bump Size | 120X210um | Follow customer requirement |
Bump Height | 11um(Cu 8um+Sn 3um) | Only Bake and no feflow allowed |
BG Thickness | 265um | Follow customer requirement |