Semiconductor Packaging and Testing Process

The packaging process is as follows: the wafer from the front-end process is cut into small dies through the dicing process, then the diced dies are mounted with adhesive onto the small islands of the corresponding substrate (lead frame), and then ultra-fine metal (gold, tin, copper, aluminum) wires or conductive resin are used to connect the bond pads of the die to the corresponding leads of the substrate to form the required circuit; then the individual dies are encapsulated and protected with a plastic package. After molding, a series of operations are performed, such as post mold cure, trim and form, plating, and marking. After packaging is completed, final testing is conducted, typically going through incoming inspection, testing, and packing processes, before being stored in the warehouse for shipment. A typical packaging process flow is: dicing, die attach, wire bonding, molding, de-flash, plating, marking, trim and form, visual inspection, final testing, packing and shipping.