◆Company project initial stage of introduction, by Ningbo Hangzhou Bay New Zone Management Committee rated as "Ningbo Hangzhou Bay New Zone High-level Entrepreneurship and Innovation Team";

◆In 2013, the company's wafer-level Advanced Packaging innovation project filled the gap of Ningbo's integrated circuit wafer-level advanced packaging and testing industry, and was selected

   as Ningbo "Smart Team Project", receiving Ningbo municipal leaders' key attention;

◆In 2014, the company achieved good results in technological transformation, won Hangzhou Bay New Zone "Technical Transformation Special Award";

◆In 2014, the ChipEx R&D Center established by the company is committed to product R&D and technological innovation, making significant contributions to the development of Ningbo's integrated circuit industry,

   the company R&D Center by Ningbo Hangzhou Bay New Zone rated as "District-level Engineering Center" and "Hangzhou Bay New Zone Innovation Team";

◆In 2015, because the company's wafer-level advanced packaging and testing project belongs to one of the six major emerging industries in the country, with the smooth progress of the project, it was rated by Ningbo

   as "Ningbo Strategic Emerging Industry";

◆2015 the company from initial stage to now continuously developed new processes, explored new markets, occupied product new fields, by Ningbo rated as "Ningbo Industrial Major

   Scientific and Technological Project";

◆In 2015, the company relying on excellent service, high-quality products, by Foxconn Group Tianyu Technology Co., Ltd. rated as "Best Partner"; at the same time by Qipan Microelectronics (Shanghai) Co., Ltd. rated as "Best Supplier"

◆Awarded the Innovation Talent Special Award by the Andong Town People's Government, etc.