LGA (Land Grid Array) is a surface mount package form where the bottom of the chip is covered with flat metal contact points, interacting with the circuit board through soldering or contact connections. LGA is commonly used for high-performance chips and applications requiring high pin counts, such as processors and communication chips.

This product has the following features:

Leadless design: Uses flat contact surfaces instead of traditional pins, reducing package thickness.

High-density connections: Supports large-scale routing, suitable for high pin count and complex circuit designs.

Direct contact soldering: Achieves reliable connection with PCB through soldering or elastic connectors.

       LGA products are commonly used in high-performance processors (such as CPUs, GPUs), communication modules (such as 5G chips), embedded devices, servers and other high-density integrated systems. Due to its high density, high performance and miniaturization advantages, it has become an important package form in modern high-end electronic devices.

CSP(Chip Scale Package)

       An ultra-small package form with dimensions close to the chip body, only about 20% larger. Solder balls typically have small spacing, suitable for compact designs of portable devices. Good compatibility, commonly used in mobile devices, IoT devices, and sensors.