Redistribution (RDL) is a process that changes the original designed IC circuit connection points (I/O pad) through wafer-level metal wiring process and Bump process to relocate the connection points, making IC applicable to different packaging formats. Wafer-level metal wiring process involves coating an insulating protective layer on the IC, then using photolithography to define new wiring patterns, and finally using electroplating technology to create new metal circuits to connect the original aluminum pads and new Bumps or gold pads, achieving the goal of circuit redistribution. The metal circuits in Redistribution are mainly made of electroplated copper material. The factory also supports CuNiAu format RDL technology. The thick copper structure has advantages of low resistance, high heat dissipation and low cost, making it a choice for high current and high power devices.